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27 Mould Wafer Biscuit Processing Line
27 Mould Wafer Biscuit Processing Line
Material: flour,oil, water,eggs, sugar and so on
Capacity: 200kg/h
Loading Port: Qingdao Port
Description:
The wafer biscuit processing line main include dough blender,oven, dough sheet catching machine, cooling machine, dough sheet picking machine, cream coating machine, freezer, cutting machine, cream mixer, and grinder.
The wafer biscuit processing line main include dough blender,oven, dough sheet catching machine, cooling machine, dough sheet picking machine, cream coating machine, freezer, cutting machine, cream mixer, and grinder.
Introduction:
The main equipment for this wafer biscuit processing line include dough blender, oven, dough sheet catching machine, cooling machine, dough sheet picking machine, cream coating machine, freezer, cutting machine, cream mixer, and grinder. The oven is very important equipment in the wafer production line. The wafer baking system uses LPG for heating of the baking plates. It is controlled by a PLC made by SIEMENS brand. The functions of the baking oven are fully automatic from spreading batter on the plates to the procedure of baked wafer sheets coming out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is a PID controller which is used to control the temperature of the baking plates automatically.
Adopting hearing-medium conduction technology with heating oil as medium, the plant is a new generation product developed exclusively in China based on the advanced structure of existing plants from domestic market and abroad. Designed and manufactured according to the facts of domestic biscuit manufacturing industry and absorbing the most well-known wafer production lines of many oversea manufacturers.
The main equipment for this wafer biscuit processing line include dough blender, oven, dough sheet catching machine, cooling machine, dough sheet picking machine, cream coating machine, freezer, cutting machine, cream mixer, and grinder. The oven is very important equipment in the wafer production line. The wafer baking system uses LPG for heating of the baking plates. It is controlled by a PLC made by SIEMENS brand. The functions of the baking oven are fully automatic from spreading batter on the plates to the procedure of baked wafer sheets coming out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is a PID controller which is used to control the temperature of the baking plates automatically.
Adopting hearing-medium conduction technology with heating oil as medium, the plant is a new generation product developed exclusively in China based on the advanced structure of existing plants from domestic market and abroad. Designed and manufactured according to the facts of domestic biscuit manufacturing industry and absorbing the most well-known wafer production lines of many oversea manufacturers.
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